Electronic graphite molds are precision graphite tooling dedicated to electronics and semiconductor industries. Fabricated from high-purity isostatic graphite and machined by 5-axis CNC, they feature low impurity content, low thermal expansion and uniform heat conduction. They serve as core fixtures for chip packaging, power device sintering and electronic ceramic forming.
Key Properties
High purity: Strictly limited impurities prevent contamination of chips and sensitive components, suitable for SiC and GaN third-generation semiconductor packaging.
Low thermal expansion: Minimal deformation during repeated heating and cooling cycles to maintain stable dimensional tolerance.
Uniform heat transfer: Consistent thermal field reduces warpage and poor bonding during sintering and curing.
Self-lubricating & non-stick: No adhesion with solder paste, silver paste or molding compound at high temperatures for smooth demolding.
Applications
Tooling for BGA, QFN, SOP and IGBT power module packaging, silver paste eutectic sintering molds, VC vapor chamber hot pressing molds, forming jigs for electronic ceramic components. Dongguan Jiecheng Graphite Products Co., Ltd. founded in 2003 customizes special cavities and positioning grooves and provides inspection reports.
